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Integrated Tray Systems

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The Sharetree Integrated Tray Component Burn-In System allows each Tray to be removed independently for device loading/unloading without significantly affecting the environment of the remaining Trays. Each Tray may be configured for a different device type, making the system ideal for applications with a variety of small batches. Trays consist of a Burn-In board directly connected to a clock/monitor board through a thermally insulated barrier.

This arrangement minimises the length of power and signal connections, reducing unwanted impedances and ensuring excellent high frequency performance. The Tray is inserted into an insulated lattice on the front of the Burn-In chamber such that the clock/monitor section remains at ambient temperature while the devices under test are at Burn-In temperature. Device power and the control bus are distributed to each aperture in the lattice such that connections are made automatically as the Tray is inserted.

 

Brochure:

Integrated Tray systems.pdf

Key Applications: 
Electronic components
Tray Capacity: 
6-36
Carrier Capacity: 
N/A
Component Testing: 
Yes
Sub-assembly testing: 
Yes
Temp - max: 
+150
Temp - min: 
-40
Static Testing: 
Yes
Dynamic Testing: 
Yes
Monitored Testing: 
Yes
Thermal Zones: 
1
Clock Drive Zones: 
6.36
Power Supply Zones: 
1-36
Weight: 
1