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MultiZone

Image: 

Trays can be continuously heated or batched into a single thermal environment. Through-the-wall connections provide power, clock, control and monitoring via driver circuits for each tray, situated outside the BI environment. MultiZone is ideal for high volume Burn-In of complex devices in a production environment. Available with either PC control or manual stand-alone visual display per tray.

 

Brochure:

Multizone component Burn-in

Key Applications: 
Electronic components
Tray Capacity: 
20
Carrier Capacity: 
N/A
Component Testing: 
Yes
Sub-assembly testing: 
Yes
Temp - max: 
+150
Temp - min: 
+50
Static Testing: 
Yes
Dynamic Testing: 
Yes
Monitored Testing: 
Yes
Thermal Zones: 
1
Clock Drive Zones: 
20
Power Supply Zones: 
1-20
Weight: 
3